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Package qualification and reliability for extreme environment

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dc.contributor.author Ghaffarian, Reza
dc.date.accessioned 2006-07-11T21:10:05Z
dc.date.available 2006-07-11T21:10:05Z
dc.date.issued 2005-02-22
dc.identifier.citation International Microelectronics and Packaging Society, Extreme Environment Workshop, Austin, Texas, February 22-24, 2005. en
dc.identifier.clearanceno 05-0530
dc.identifier.uri http://hdl.handle.net/2014/39492
dc.description.sponsorship NASA/JPL en
dc.format.extent 1804697 bytes
dc.format.mimetype application/pdf
dc.language.iso en_US en
dc.publisher Pasadena, CA : Jet Propulsion Laboratory, National Aeronautics and Space Administration, 2005.' en
dc.subject thermal cycles en
dc.subject IPC specifications en
dc.subject extreme cold en
dc.subject solder joint en
dc.title Package qualification and reliability for extreme environment en
dc.type Presentation en


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