Package qualification and reliability for extreme environment

Ghaffarian, Reza

dc.contributor.author	Ghaffarian, Reza
dc.date.accessioned	2006-07-11T21:10:05Z
dc.date.available	2006-07-11T21:10:05Z
dc.date.issued	2005-02-22
dc.identifier.citation	International Microelectronics and Packaging Society, Extreme Environment Workshop, Austin, Texas, February 22-24, 2005.	en
dc.identifier.clearanceno	05-0530
dc.identifier.uri	http://hdl.handle.net/2014/39492
dc.description.sponsorship	NASA/JPL	en
dc.format.extent	1804697 bytes
dc.format.mimetype	application/pdf
dc.language.iso	en_US	en
dc.publisher	Pasadena, CA : Jet Propulsion Laboratory, National Aeronautics and Space Administration, 2005.'	en
dc.subject	thermal cycles	en
dc.subject	IPC specifications	en
dc.subject	extreme cold	en
dc.subject	solder joint	en
dc.title	Package qualification and reliability for extreme environment	en
dc.type	Presentation	en