JPL Technical Report Server

Browsing by Subject "package type board material surface finish solder volume environmental condition"

Browsing by Subject "package type board material surface finish solder volume environmental condition"

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  • Ghaffarian, R. (1998-03-01)
    Different aspects of advanced surface mount package technology have been investigated for aerospace applications. Three key areas included the assembly reliability of conventional Surface Mount, Ball Grid Arrays (BGAs), ...