JPL Technical Report Server

Browsing by Subject "2D X-ray"

Browsing by Subject "2D X-ray"

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  • Ghaffarian, Reza (Pasadena, CA : Jet Propulsion Laboratory, National Aeronautics and Space Administration, 2014, 2014-04-17)
    Flip-chip (FC) die is the only known technique that enables high I/O (>1000) ball grid array/column grid array (BGA/CGA) electronic packages. One of the key drawbacks of packages with solder balls/columns and solder joint ...