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BEACON eSpace at Jet Propulsion Laboratory >
Items for Subject "packaging"
Showing 10 items.
| Issue Date | Title | Author(s) |
| 8-Feb-2011 |
Class Y - non-hermetic ICs for space. |
Sampson, Michael J.; Agarwal, Shri; Roosta, Ramin; Wilson, Tom |
| 8-Feb-2011 |
Class Y : non-hermetic ICs for space |
Sampson, Michael J.; Agarwal, Shri; Roosta, Ramin; Wilson, Tom |
| Mar-2004 |
Electronic packaging for extended Mars surface missions |
Shapiro, Andrew A.; Ling, Sharon X.; Ganesan, Sanka; Cozy, R. Scott; Hunter, Donald J.; Schatzel, Donald V.; Mojarradi, Mohammad M. |
| 4-Apr-2011 |
Experimental study of a membrane antenna surface adaptive control system |
Fang, H.; Quijano, U.; Bach, V.; Hill, J.; Wang, K. W. |
| Feb-2012 |
High-Density 3D TSOP Stack Packaging NEPP FY11 Summary Report |
Phillip, Zulueta |
| Dec-2011 |
Modeling the effects of hydrogen and dose rate sensitivity in CMOS and bipolar technologies |
Adell, Philippe; Sanchez, Ivan; Barnaby, Hugh |
| 28-Mar-2004 |
NASA Electronic Parts & Packaging (NEPP) program: contributions to MER success |
Barnes, Charles E.; Ramesham, R.; Johnston, A.; Zulueta, P.; Ghaffarian, R.; Scheick, L.; LaBel, K.; Sampson, M. |
| Nov-2011 |
Qualification of emerging point-of-load regulators for next generation power systems |
Adell, Philippe; Leon, Rosa |
| Nov-2011 |
Single-event transients evaluation of emerging point-of-load converters using the new JPL Pico-Second Pulsed Laser System |
Allen, Gregory; Adell, Philippe |
| Jul-2003 |
Use of plastic commericial off-the-shelf (COTS) microcircuits for space applications |
Gerke, R. David; Shapiro, Andrew A.; Agarwal, Shri; Peters, David M.; Sandor, Michael A. |
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