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Please use this identifier to cite or link to this item: http://hdl.handle.net/2014/9623

Title: Packaging of microwave integrated circuits operating beyond 100 GHz
Authors: Samoska, L.
Daniel, E.
Sokolov, V.

Bublitz, J.
Olson, K.

Chow, D.
Issue Date: 6-Aug-2002
Citation: Lester Eastman Conference on High Performance Devices
Ithaca, NY, USA
Abstract: Several methods of packaging high speed (75-330 GHz) InP HEMT MMIC devices are discussed. Coplanar wirebonding is presented with measured insertion loss of less than 0.5dB and return loss better than -17 dB from DC to 110 GHz. A motherboard/daughterboard packaging scheme is presented which supports minimum loss chains of MMICs using this coplanar wirebonding method. Split waveguide block packaging approaches are presented in G-band (140-220 GHz) with two types of MMIC-waveguide transitions: E-plane probe andantipodal finline.
URI: http://hdl.handle.net/2014/9623
Appears in Collections:JPL TRS 1992+

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