NASA Jet Propulsion Laboratory California Institute of Technology Follow this link to skip to the main content

BEACON eSpace at Jet Propulsion Laboratory >
JPL Technical Report Server >
JPL TRS 1992+ >

Please use this identifier to cite or link to this item:

Title: Packaging of microwave integrated circuits operating beyond 100 GHz
Authors: Samoska, L.
Daniel, E.
Sokolov, V.

Bublitz, J.
Olson, K.

Chow, D.
Issue Date: 6-Aug-2002
Citation: Lester Eastman Conference on High Performance Devices
Ithaca, NY, USA
Abstract: Several methods of packaging high speed (75-330 GHz) InP HEMT MMIC devices are discussed. Coplanar wirebonding is presented with measured insertion loss of less than 0.5dB and return loss better than -17 dB from DC to 110 GHz. A motherboard/daughterboard packaging scheme is presented which supports minimum loss chains of MMICs using this coplanar wirebonding method. Split waveguide block packaging approaches are presented in G-band (140-220 GHz) with two types of MMIC-waveguide transitions: E-plane probe andantipodal finline.
Appears in Collections:JPL TRS 1992+

Files in This Item:

File SizeFormat
02-1724.pdf3.88 MBAdobe PDFView/Open

Items in DSpace are protected by copyright, but are furnished with U.S. government purpose use rights.


Privacy/Copyright Image Policy Beacon Home Contact Us
NASA Home Page + Div 27
+ JPL Space
Site last updated on December 5, 2014.
If you have any comments or suggestions for this web site, please e-mail Robert Powers.