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Please use this identifier to cite or link to this item:
http://hdl.handle.net/2014/7075
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| Title: | Issues concering the replacement of lead in Hi-Rel electronic applications |
| Authors: | Bonner, J. K.
Castillo, L. Del
Mehta, A. |
| Issue Date: | 3-Apr-2003 |
| Citation: | Industrial-Ecology UC-Discovery Grant Research Symposium: Electronic Design, Manufacturing, and the Environment
Irvine, CA, USA |
| Abstract: | This paper examines some of these alternative solders for their suitability in replacing tin/lead solder in high-reliability applications. |
| URI: | http://hdl.handle.net/2014/7075 |
| Appears in Collections: | JPL TRS 1992+
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