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Title: Issues concering the replacement of lead in Hi-Rel electronic applications
Authors: Bonner, J. K.
Castillo, L. Del
Mehta, A.
Issue Date: 3-Apr-2003
Citation: Industrial-Ecology UC-Discovery Grant Research Symposium: Electronic Design, Manufacturing, and the Environment
Irvine, CA, USA
Abstract: This paper examines some of these alternative solders for their suitability in replacing tin/lead solder in high-reliability applications.
Appears in Collections:JPL TRS 1992+

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