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Title: Qualification and reliability testing of a microchip laser system for space applications
Authors: Wright, M. W.
Hemmati, H.
Franzen, D.
Sandor, M.
Issue Date: 7-Jul-2003
Citation: Electronic Packaging Technical Conference - InterPACK03
Maui, HI, USA
Abstract: This paper discusses the process being used and the results of the selection and qualification of a low cost prepackaged diode laser with a custom packaged microchip laser crystal.
Appears in Collections:JPL TRS 1992+

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