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Please use this identifier to cite or link to this item:
http://hdl.handle.net/2014/42321
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| Title: | BOK─Underfill Optimization for FPGA Package/Assembly |
| Authors: | Ghaffarian, Reza |
| Keywords: | Underfill
solder joint reliability
thermal cycle
mechanical fatigue
flip-chip ball grid array (FCBGA) |
| Issue Date: | Sep-2011 |
| Publisher: | Pasadena, CA : Jet Propulsion Laboratory, National Aeronautics and Space Administration, 2011. |
| Series/Report no.: | JPL Publication
12-13 |
| Abstract: | Commercial-off-the-shelf area array package technologies in high-reliability versions are being considered for NASA electronic systems. These packages are prone to early failure due to the severe mechanical shock and vibration of launch, as well as other less severe conditions, such as mechanical loading during descent, rough terrain mobility, handling, and ground tests. As the density of these packages increases and the size of ball interconnections decrease, susceptibility to mechanical loading and cycling fatigue grows. This report presents a summary of the body of knowledge developed for the evaluation of area array packages and is based on surveys of literature from industry and academia. For high-reliability applications, the limited data that exists will be presented. Most data from industry deals with mechanical fatigue caused by four-point bend tests, as well as from drop tests for hand-held electronics; the most recent data will be presented, along with a brief background of prior literature. Understanding the key design guidelines and failure mechanisms from past tests is critical to developing an approach that will minimize future failures. Additional specific testing enables low-risk insertion of these advanced electronic packages. |
| URI: | http://hdl.handle.net/2014/42321 |
| Appears in Collections: | JPL TRS 1992+
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