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|Title: ||Temperature effects on adhesive bond strengths and modulus for commonly used spacecraft stuctural adhesives|
|Authors: ||Ojeda, Cassandra E.|
Oakes, Eric J.
Hill, Jennifer R.
Forsberg, Gustaf A.
|Keywords: ||structural adhesives testing|
bond line strength
|Issue Date: ||23-May-2011 |
|Publisher: ||Pasadena, CA : Jet Propulsion Laboratory, National Aeronautics and Space Administration, 2011.|
|Citation: ||SAMPE 2011, Long Beach, California, May 23-26, 2011.|
|Abstract: ||A study was performed to observe how changes in temperature and substrate material affected the strength and modulus of an adhesive bondline. Seven different adhesives commonly used in aerospace bonded structures were tested. Aluminum, titanium and Invar adherends were cleaned and primed, then bonded using the manufacturer’s recommendations. Following surface preparation, the coupons were bonded with the adhesives. The single lap shear coupons were then pull tested per ASTM D 1002 Standard Test Method for Apparent Shear Strength of Single- Lap-Joint over a temperature range from -150°C up to +150°C. The ultimate strength was calculated and the resulting data were converted into B-basis design allowables. Average and Bbasis results were compared. Results obtained using aluminum adherends are reported. The effects of using different adherend materials and temperature were also studied and will be reported in a subsequent paper. Dynamic Mechanical Analysis (DMA) was used to study variations in adhesive modulus with temperature. This work resulted in a highly useful database for comparing adhesive performance over a wide range of temperatures, and has facilitated selection of the appropriate adhesive for spacecraft structure applications.|
|Appears in Collections:||JPL TRS 1992+|
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