|
BEACON eSpace at Jet Propulsion Laboratory >
JPL Technical Report Server >
JPL TRS 1992+ >
Please use this identifier to cite or link to this item:
http://hdl.handle.net/2014/41404
|
| Title: | Reliability of recolumned area array packages |
| Authors: | Ghaffarian, Reza |
| Keywords: | radiation
array packages
photomicrographs
thermal tests |
| Issue Date: | Mar-2009 |
| Publisher: | Pasadena, CA : Jet Propulsion Laboratory, National Aeronautics and Space Administration, 2009. |
| Series/Report no.: | JPL Publication
09-11 |
| Abstract: | This report presents qualification guidelines developed for recolumned, high I/O ceramic column grid array (CCGA) packages assembled onto printed wiring/circuit boards (PWBs/PCBs). It includes recolumn and assembly process development for two types of CCGA packages: those with and those without interposer. Thermal cycle test results and photomicrographs showing damage progress for recolumned CCGA assemblies are documented and presented. |
| URI: | http://hdl.handle.net/2014/41404 |
| Appears in Collections: | JPL TRS 1992+
|
Items in DSpace are protected by copyright, with all rights reserved, unless otherwise indicated.
|
