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Please use this identifier to cite or link to this item:
http://hdl.handle.net/2014/41385
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| Title: | Advanced embedded active assemblies for Extreme Space Applications |
| Authors: | Del Castillo, Linda
Moussessian, Alina
Mojarradi, Mohammad
Kolawa, Elizabeth |
| Keywords: | avionics
flip chip devices
lead bonding
liquid crystal polymers |
| Issue Date: | 8-Jan-2009 |
| Publisher: | IEEE |
| Citation: | Aerospace conference, 2009 IEEE, 7-14 March, DIO: 10.1109/AERO.2009.4839527 |
| Abstract: | This work describes the development and evaluation of advanced technologies for the integration of electronic die within membrane polymers. Specifically, investigators thinned silicon die, electrically connecting them with circuits on flexible liquid crystal polymer (LCP), using gold thermo-compression flip chip bonding, and embedding them within the material. Daisy chain LCP assemblies were thermal cycled from -135 to +85degC (Mars surface conditions for motor control electronics). The LCP assembly method was further utilized to embed an operational amplifier designed for operation within the Mars surface ambient. The embedded op-amp assembly was evaluated with respect to the influence of temperature on the operational characteristics of the device. Applications for this technology range from multifunctional, large area, flexible membrane structures to small-scale, flexible circuits that can be fit into tight spaces for flex to fit applications. |
| URI: | http://hdl.handle.net/2014/41385 |
| Appears in Collections: | JPL TRS 1992+
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