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Please use this identifier to cite or link to this item:
http://hdl.handle.net/2014/41096
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| Title: | FPGA NEPP FY08 Summary Report |
| Authors: | Sheldon, Douglas |
| Keywords: | Functional Reliability Analysis
Parametric Reliability Analysis |
| Issue Date: | Jan-2009 |
| Publisher: | Pasadena, CA : Jet Propulsion Laboratory, National Aeronautics and Space Administration, 2009. |
| Series/Report no.: | JPL Publication
09-01 |
| Abstract: | This report documents the activities and results of the Fiscal Year 2008 (FY08) funding for the NASA Electronic Parts and Packaging (NEPP) program for Re-programmable Field Programmable Gate Arrays (FPGA). The FY08 task was divided into two sections. The first was focused on establishing a plan to develop long-term life-test reliability circuit designs with Xilinx, the manufacturer of the FPGAs of interest. Long-term life tests are the basic tool of technology analysis. Results from life tests are used to identify failure mechanisms and to provide quantitative estimates of device performance over the various required mission lifetimes. The second section was to develop parametric test capability for state-of-the-art FPGAs. This test capability was developed with Integra Corporation. Parametric testing is the first line of electrical testing of FPGAs. Results from parametric testing are used to determine whether or not the device meets the manufacturer’s data sheet specifications. Parametric testing is also used to determine quality and variability of devices obtained by a customer... |
| URI: | http://hdl.handle.net/2014/41096 |
| Appears in Collections: | JPL TRS 1992+
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