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Please use this identifier to cite or link to this item: http://hdl.handle.net/2014/40794

Title: Effects of hand soldering MIL-PRF 55365 tantalum capacitors
Authors: Reed, Erik K.
Spence, Penelope L.
Sheldon, Douglas
Keywords: thermal stress
hand soldering
Issue Date: Mar-2008
Publisher: Pasadena, CA : Jet Propulsion Laboratory, National Aeronautics and Space Administration, 2008.
Series/Report no.: JPL Publication
08-12
Abstract: Different values of MIL-PRF-55365 tantalum capacitors were subjected to three different types of soldering conditions— Convection Reflow, JPL Standard Hand Soldering, and Optimized Hand Soldering. The electrical parameters for a large number of capacitors of each value were measured before and after thermal soldering stress. The results indicate that tantalum capacitors subjected to convection reflow conditions experience detectable changes in electrical parameters; capacitors subjected to hand solder conditions show reduced changes in electrical parameters when compared to the reflow samples. Optimized hand solder conditions are shown to have a minimal effect on electrical parameters.
URI: http://hdl.handle.net/2014/40794
Appears in Collections:JPL TRS 1992+

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