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|Title: ||A wafer transfer technology for MEMS adaptive optics|
|Authors: ||Yang, Eui-Hyeok|
Wiberg, Dean V.
|Keywords: ||wafer transfers|
Micro Electro Mechanical Systems (MEMS)
|Issue Date: ||16-Nov-2001 |
|Publisher: ||Pasadena, CA : Jet Propulsion Laboratory, National Aeronautics and Space Administration, 2001.|
|Citation: ||ASME MEMES Symposium / International Mechanical Engineering Congress and Exposition, New York, New York, November 16, 2001.|
|Abstract: ||Adaptive optics systems require the combination of several advanced technologies such as precision optics, wavefront sensors, deformable mirrors, and lasers with high-speed control systems. The deformable mirror with a continuous membrane is a key component of these systems. This paper describes a new technique for transferring an entire wafer-level silicon membrane from one substrate to another. This technology is developed for the fabrication of a compact deformable mirror with a continuous facet. A 1 μm thick silicon membrane, 100 mm in diameter, has been successfully transferred without using adhesives or polymers (i.e. wax, epoxy, or photoresist). Smaller or larger diameter membranes can also be transferred using this technique. The fabricated actuator membrane with an electrode gap of 1.5 μm shows a vertical deflection of 0.37 μm at 55 V.|
|Appears in Collections:||JPL TRS 1992+|
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