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Title: Extreme temperature electronics using a reconfigurable analog array
Authors: Zebulum, Ricardo S.
Rejeshuni, Ramesham
Keymeulen, Didier
Daud, Taher
Neff, Joseph
Stoica, Adrian
Keywords: evolvable hardware
reconfigurable analog array (RAA)
extreme environments
Issue Date: 4-Mar-2006
Publisher: Pasadena, CA : Jet Propulsion Laboratory, National Aeronautics and Space Administration, 2006.
Citation: IEEE Aerospace Conference, Big Sky, Montana, March 4-11, 2006.
Abstract: Temperature and radiation tolerant electronics, as well as long life survivability are key capabilities required for future NASA missions. Current approaches to electronics for extreme environments focus on component level robustness and hardening. Compensation techniques such as bias cancellation circuitry have also been employed. However, current technology can only ensure very limited lifetime in extreme environments. Previous work presented a novel approach, based on evolvable hardware technology, which allows adaptive in-situ circuit redesign/reconfiguration during operation in extreme environments. This technology would complement material/device advancements and increase the mission capability to survive harsh environments. This work describes a new reconfigurable analog chip developed by JPL and SPAWAR that is targeted for extreme temperature and evolutionary hardware experiments. Being based on Gm-C technology, this chip can have its functionality tuned and adapted to extreme temperatures through voltage bias adjustment. This tuning process will be controlled by Evolutionary Algorithms. This paper presents details of the reconfigurable analog chip as well as a system level overview. Some early experiments are also described.
Appears in Collections:JPL TRS 1992+

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