|
BEACON eSpace at Jet Propulsion Laboratory >
JPL Technical Report Server >
JPL TRS 1992+ >
Please use this identifier to cite or link to this item:
http://hdl.handle.net/2014/39978
|
| Title: | Qualification and reliability for MEMS and IC packages |
| Authors: | Ghaffarian, Reza |
| Keywords: | thermal cycles
solder joint
area array package
reliability
microelectromechanical systems (MEMS)
inertial measurement unit
Mars Exploration Rover (MER)
electronic packaging |
| Issue Date: | 26-Sep-2004 |
| Publisher: | Pasadena, CA : Jet Propulsion Laboratory, National Aeronautics and Space Administration, 2004. |
| Citation: | Surface Mount Technology Association (SMTA), Chicago, Illinois, September 26-30, 2004. |
| Abstract: | This paper will review four standards that already released or being developed that specifically address the issues on qualification and reliability of assembled packages. Exposures to thermal cycles, monotonic bend test, mechanical shock and drop are covered in these specifications. Finally, mechanical and thermal cycle qualification data generated for MEMS accelerometer will be presented. The MEMS was an element of an inertial measurement unit (IMU) qualified for NASA Mars Exploration Rovers (MERs), Spirit and Opportunity that successfully is currently roaring the Martian surface. |
| URI: | http://hdl.handle.net/2014/39978 |
| Appears in Collections: | JPL TRS 1992+
|
Items in DSpace are protected by copyright, with all rights reserved, unless otherwise indicated.
|
