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Please use this identifier to cite or link to this item:
http://hdl.handle.net/2014/39492
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| Title: | Package qualification and reliability for extreme environment |
| Authors: | Ghaffarian, Reza |
| Keywords: | thermal cycles
IPC specifications
extreme cold
solder joint |
| Issue Date: | 22-Feb-2005 |
| Publisher: | Pasadena, CA : Jet Propulsion Laboratory, National Aeronautics and Space Administration, 2005.' |
| Citation: | International Microelectronics and Packaging Society, Extreme Environment Workshop, Austin, Texas, February 22-24, 2005. |
| URI: | http://hdl.handle.net/2014/39492 |
| Appears in Collections: | JPL TRS 1992+
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