NASA Jet Propulsion Laboratory California Institute of Technology Follow this link to skip to the main content

BEACON eSpace at Jet Propulsion Laboratory >
JPL Technical Report Server >
JPL TRS 1992+ >

Please use this identifier to cite or link to this item: http://hdl.handle.net/2014/39492

Title: Package qualification and reliability for extreme environment
Authors: Ghaffarian, Reza
Keywords: thermal cycles
IPC specifications
extreme cold
solder joint
Issue Date: 22-Feb-2005
Publisher: Pasadena, CA : Jet Propulsion Laboratory, National Aeronautics and Space Administration, 2005.'
Citation: International Microelectronics and Packaging Society, Extreme Environment Workshop, Austin, Texas, February 22-24, 2005.
URI: http://hdl.handle.net/2014/39492
Appears in Collections:JPL TRS 1992+

Files in This Item:

File Description SizeFormat
05-0530.pdf1.76 MBAdobe PDFView/Open

Items in DSpace are protected by copyright, but are furnished with U.S. government purpose use rights.

 

Privacy/Copyright Image Policy Beacon Home Contact Us
NASA Home Page + Div 27
+ JPL Space
Site last updated on November 15, 2012.
If you have any comments or suggestions for this web site, please e-mail Alexander Smith or call 4-4202.