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|Title: ||A Nanochannel fabrication technique using chemical-mechanical polishing (CMP) and thermal oxidation|
|Authors: ||Lee, Choonsup|
Myung, Nosang V.
Chemical-Mechanical Polishing (CMP)
|Issue Date: ||5-Oct-2003 |
|Publisher: ||Pasadena, CA : Jet Propulsion Laboratory, National Aeronautics and Space Administration, 2003.|
|Citation: ||micro-TAS 2003, Squaw Valley, CA, October 5-9, 2003|
|Abstract: ||We have developed a new nanochannel fabrication technique using chemical-mechanical polishing (CMP) and thermal oxidation. With this technique, it is possible to control the width, length, and depth of the nanochannels without the need for nanolithography. The use of sacrificial SiO2 layers allows the fabrication of centimeter-long nanochannels. In addition, the fabrication process is CMOS compatible. We have successfully fabricated an array of extremely long and narrow nanochannels (i.e. 10 mm long, 25 nm wide and 100 nm deep) with smooth inner surfaces.|
|Appears in Collections:||JPL TRS 1992+|
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