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Please use this identifier to cite or link to this item:
http://hdl.handle.net/2014/38569
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| Title: | Solder joint fatigue analysis under low temperature Martian conditions |
| Authors: | Tudryn, Carissa |
| Keywords: | fatigue
low temperature
Mars
solder |
| Issue Date: | Mar-2006 |
| Publisher: | Pasadena, CA : Jet Propulsion Laboratory, National Aeronautics and Space Administration, 2006. |
| Citation: | 2006 IEEE Aerospace Conference, Big Sky, MT, March 4-11, 2006 |
| Abstract: | Electronics, without requiring heater power or enclosure in a centralized "warm electronics box," will need to survive mean surface temperatures of -120 degrees Celsius to +20 degrees Celsius for an extended Martian mission and an operational temperature up to 85 degrees Celsisus. Since these electronics will need to survive extended cycles under these conditions, fatigue is a significant concern. The solder joint reliability of connectors on a printed wiring board was investigated. |
| URI: | http://hdl.handle.net/2014/38569 |
| Appears in Collections: | JPL TRS 1992+
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