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Please use this identifier to cite or link to this item:
http://hdl.handle.net/2014/38117
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| Title: | Visual and x-ray inspection characteristics of eutectic and lead free assemblies |
| Authors: | Ghaffarian, R. |
| Keywords: | inspection
x-ray
ceramic column grid array
CCGA
CGA
solder joint
thermal cycle
lead free |
| Issue Date: | Sep-2003 |
| Publisher: | Pasadena, CA : Jet Propulsion Laboratory, National Aeronautics and Space Administration, 2003. |
| Citation: | SMTA (Sufrace Mount Technology Association), Chicago, IL, September 22-26, 2003 |
| Abstract: | For high reliability applications, visual inspection has been the key technique for most conventional electronic package assemblies. Now, the use of x-ray technique has become an additional inspection requirement for quality control and detection of unique defects due to manufacturing of advanced electronic array packages such as ball grid array (BGAs) and chip scale packages (CSPs). |
| URI: | http://hdl.handle.net/2014/38117 |
| Appears in Collections: | JPL TRS 1992+
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