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Please use this identifier to cite or link to this item:
http://hdl.handle.net/2014/36900
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| Title: | Electrical and structural investigation of the effects of via-conductor geometry in the electromigration of AL:CU |
| Authors: | Leon, R.
Vu, D.
Johnson, A. S.
Ruiz, R.
Okuno, J.
Uribe, J.
Hather, G.
Lloyd, . R. |
| Issue Date: | Nov-2001 |
| Citation: | Fall Meeting of the Materials Research Society
Boston, MA, USA |
| Abstract: | Electromigration experiments, their results at different densities. |
| URI: | http://hdl.handle.net/2014/36900 |
| Appears in Collections: | JPL TRS 1992+
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