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|Title: ||Electrical and structural investigation of the effects of via-conductor geometry in the electromigration of AL:CU|
|Authors: ||Leon, R.|
Johnson, A. S.
Lloyd, . R.
|Issue Date: ||Nov-2001 |
|Citation: ||Fall Meeting of the Materials Research Society|
Boston, MA, USA
|Abstract: ||Electromigration experiments, their results at different densities.|
|Appears in Collections:||JPL TRS 1992+|
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