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Please use this identifier to cite or link to this item: http://hdl.handle.net/2014/36900

Title: Electrical and structural investigation of the effects of via-conductor geometry in the electromigration of AL:CU
Authors: Leon, R.
Vu, D.
Johnson, A. S.
Ruiz, R.
Okuno, J.
Uribe, J.
Hather, G.
Lloyd, . R.
Issue Date: Nov-2001
Citation: Fall Meeting of the Materials Research Society
Boston, MA, USA
Abstract: Electromigration experiments, their results at different densities.
URI: http://hdl.handle.net/2014/36900
Appears in Collections:JPL TRS 1992+

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