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Title: The Properties of CrN/Au and Cr/CrN/Au Multilayers
Authors: Kolawa, E.
Lie, D.
Reid, J.
Tai, B.
Lowry, L.
Scott-Monck, J.
Issue Date: 25-Apr-1994
Citation: International Conference of Metallurgical Coatings and Thin Films
San Diego, California, USA
Abstract: Gold has been used as a conductor material in many microelectronic applications because of its low resistivity, bondability, and oxidation/corrosion resistance.
Appears in Collections:JPL TRS 1992+

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