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Please use this identifier to cite or link to this item: http://hdl.handle.net/2014/35257

Title: Mechanical Stress Effects on Electromigration Voiding in a Meandering Test Stripe
Authors: Lowry, L. E.
Tai, B. H.
Mattila, J.
Walsh, L. H.
Issue Date: Apr-1993
Citation: San Francisco, California, USA
Abstract: Earlier experimental findings concluded that electromigratin voids in these meandering stripe test structures were not randomly distributed and that void nucleation frequenly occurred sub-surface at the metal/thermal oxide interface.
URI: http://hdl.handle.net/2014/35257
Appears in Collections:JPL TRS 1992+

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