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|Title: ||Mechanical Stress Effects on Electromigration Voiding in a Meandering Test Stripe|
|Authors: ||Lowry, L. E.|
Tai, B. H.
Walsh, L. H.
|Issue Date: ||Apr-1993 |
|Citation: ||San Francisco, California, USA|
|Abstract: ||Earlier experimental findings concluded that electromigratin voids in these meandering stripe test structures were not randomly distributed and that void nucleation frequenly occurred sub-surface at the metal/thermal oxide interface.|
|Appears in Collections:||JPL TRS 1992+|
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