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Title: Multichip MMIC Package for X and Ka-bands
Authors: Decker, D.
Olson, H.
Tatikola, R.
Neuman, S.
Gutierrez, R.
Mysoor, N.
Issue Date: 22-May-1994
Citation: IEEE, International Microwave Interconnect and Packaging Technology Symposium
San Diego, California, USA
Abstract: This package provides space for mounting up to five MMIC chips and has three RF and five DC feed-throughs.
Appears in Collections:JPL TRS 1992+

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