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Please use this identifier to cite or link to this item: http://hdl.handle.net/2014/33286

Title: Thermoelectric Devices and Diamond Films for Temperature Control of High Density Electronic Circuits
Authors: Vandersande, J.
Ewell, R.
Fleurial, J-P.
Lyon, H.
Issue Date: 30-Aug-1994
Citation: International Thermoelectric Society
Kansas City, Kansas, USA
Abstract: The increased speeds of integrated circuits is accompanied by increased power levels and the need to package the IC chips very close together.
URI: http://hdl.handle.net/2014/33286
Appears in Collections:JPL TRS 1992+

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