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Please use this identifier to cite or link to this item: http://hdl.handle.net/2014/27783

Title: Quality and Reliability of BGA and SMT Components
Authors: Ghaffarian, R.
Issue Date: 1996
Abstract: Spacecraft electronics including those used at the Jet Propulsion Laboratory (JPL), demand production of highly reliable assemblies. More than 400 test vehicles were assembled using ceramic and plastic ball grid arrays (BGAs), LCCs, J-leads, and gull wing components.
URI: http://hdl.handle.net/2014/27783
Appears in Collections:JPL TRS 1992+

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