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Title: Taguchi Experimental Design for Cleaning PWAs with Ball Grid Arrays
Authors: Bonner, J.K.
Mehta, A.
Walton, S.
Issue Date: 25-Feb-1997
Citation: Anaheim, California, USA
Abstract: Ball grid arrays (BGAs), and other area array packages, are becoming more prominent as a way to increase component pin count while avoiding the manufacturing difficulties inherent in processing quad flat packs (QFPs)...Cleaning printed wiring assemblies (PWAs) with BGA components mounted on the surface is problematic...Currently, a low flash point semi-aqueous material, in conjunction with a batch cleaning unit, is being used to clean PWAs. The approach taken at JPL was to investigate the use of (1) semi-aqueous materials having a high flash point and (2) aqueous cleaning involving a saponifier.
Appears in Collections:JPL TRS 1992+

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