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Please use this identifier to cite or link to this item: http://hdl.handle.net/2014/22653

Title: Thermoelectric Microcoolers for Thermal Management Applications
Authors: Fleurial, J. P.
Borshchevsky, A.
Ryan, M. A.
Phillips, W.
Kolawa, E.
Ewell, R.
Issue Date: 2-Aug-1997
Citation: Dresden, Germany
Abstract: Due to the combined increase in circuit integration and chip power dissipation, there is a rapidly growing demand for solving the thermal management issues of power microelectronics.
URI: http://hdl.handle.net/2014/22653
Appears in Collections:JPL TRS 1992+

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