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|Title: ||Thermoelectric Microcoolers for Thermal Management Applications|
|Authors: ||Fleurial, J. P.|
Ryan, M. A.
|Issue Date: ||2-Aug-1997 |
|Citation: ||Dresden, Germany|
|Abstract: ||Due to the combined increase in circuit integration and chip power dissipation, there is a rapidly growing demand for solving the thermal management issues of power microelectronics.|
|Appears in Collections:||JPL TRS 1992+|
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