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|Title: ||Packaging for Spacecraft and Its Commercial Implications|
|Authors: ||Hartley, Frank|
Bolin, Stephen R.
|Issue Date: ||May-1997 |
|Citation: ||Boston, Massachusetts|
|Abstract: ||This paper discusses aspects of electronic packaging which are critical to MEMS devices and in particular, of extreme importance to packaging devices which are intended for use aboard spacecraft.|
|Appears in Collections:||JPL TRS 1992+|
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