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|Title: ||A Systems Approach for Quality and Reliability of Chip Scale Package Assembly|
|Authors: ||Ghaffarian, R.|
|Issue Date: ||6-Mar-1999 |
|Citation: ||MTG: 1999 IEEE Aerospace Conference|
Aspen, CO, U.S.A.
|Abstract: ||This paper reviews many factors that affect interconnect reliability of commercial-off-the-shelf (COSTS) chip scale package (CSP) assemblies.|
|Appears in Collections:||JPL TRS 1992+|
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