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Title: A Systems Approach for Quality and Reliability of Chip Scale Package Assembly
Authors: Ghaffarian, R.
Issue Date: 6-Mar-1999
Citation: MTG: 1999 IEEE Aerospace Conference
Aspen, CO, U.S.A.
Abstract: This paper reviews many factors that affect interconnect reliability of commercial-off-the-shelf (COSTS) chip scale package (CSP) assemblies.
Appears in Collections:JPL TRS 1992+

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