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Please use this identifier to cite or link to this item:
http://hdl.handle.net/2014/20718
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| Title: | A Systems Approach for Quality and Reliability of Chip Scale Package Assembly |
| Authors: | Ghaffarian, R. |
| Issue Date: | 6-Mar-1999 |
| Citation: | MTG: 1999 IEEE Aerospace Conference
Aspen, CO, U.S.A. |
| Abstract: | This paper reviews many factors that affect interconnect reliability of commercial-off-the-shelf (COSTS) chip scale package (CSP) assemblies. |
| URI: | http://hdl.handle.net/2014/20718 |
| Appears in Collections: | JPL TRS 1992+
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