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Please use this identifier to cite or link to this item: http://hdl.handle.net/2014/20668

Title: Low Pressure and Low Temperature Hermetic Wafer Bonding Using Microwave Heating
Authors: Budraa, N.
Jackson, H. W.
Barmatz, M.
Pike, W. T.
Mai, J. D.
Issue Date: 17-Jan-1999
Citation: Micro Electro Mechanical Systems
Orlando, FL, U.S.A.
Abstract: We bonded gold on silicon substrates (Au/Si) for a MEMS application by using microwave radiation in a single-mode cavity.
URI: http://hdl.handle.net/2014/20668
Appears in Collections:JPL TRS 1992+

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