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Please use this identifier to cite or link to this item:
http://hdl.handle.net/2014/20668
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| Title: | Low Pressure and Low Temperature Hermetic Wafer Bonding Using Microwave Heating |
| Authors: | Budraa, N.
Jackson, H. W.
Barmatz, M.
Pike, W. T.
Mai, J. D. |
| Issue Date: | 17-Jan-1999 |
| Citation: | Micro Electro Mechanical Systems
Orlando, FL, U.S.A. |
| Abstract: | We bonded gold on silicon substrates (Au/Si) for a MEMS application by using microwave radiation in a single-mode cavity. |
| URI: | http://hdl.handle.net/2014/20668 |
| Appears in Collections: | JPL TRS 1992+
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