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Title: Manufacturing Robustness of CSP in SMT Line
Authors: Ghaffarian, R.
Chen, A.
Romas, N.
Bragg, J.
Quan, C.
Smith, M.
Sterian, I.
Issue Date: 16-Dec-1999
Citation: SMTA, International CSP Symposium
San Jose, California, USA
Abstract: In this paper, the assembly process flow, solder paste for different stencil design, manufacturing defects, X-ray inspection results, and ultrasonic characterizations are reported.
Appears in Collections:JPL TRS 1992+

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