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Please use this identifier to cite or link to this item:
http://hdl.handle.net/2014/17403
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| Title: | A 90 GHz Amplifier Assembled Using a Bump-Bonded InP-based HEMT |
| Authors: | Samoska, L.
Pinsukanjana, P.
Gaier, T.
Smith, R.
Ksendzov, A.
Fitzsimmons, M.
Martin, S. |
| Issue Date: | 17-Oct-1999 |
| Citation: | IEEE, GaAs Integrated Circuit Symposium
Monterey, California, USA |
| Abstract: | We report on the performance of a novel W-band amplifier fabricated utilizing very compact bump bonds. |
| URI: | http://hdl.handle.net/2014/17403 |
| Appears in Collections: | JPL TRS 1992+
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