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Please use this identifier to cite or link to this item: http://hdl.handle.net/2014/17098

Title: Technical Challenges in Reliable MicroelectroniCs Packaging of Microelectromechanical Systems (MEMS) for Space Applications
Authors: Ramesham, R.
Issue Date: May-1999
Citation: Electronics Packaging for Space Application Workshop
Pasadena, CA, USA
Abstract: MEMS have shown a significant promise in the last decade for a variety of applications such as air-bag, pressure sensors, accelerometer, microgyro, chemical sensors, artificial nose, etc.
URI: http://hdl.handle.net/2014/17098
Appears in Collections:JPL TRS 1992+

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