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Please use this identifier to cite or link to this item:
http://hdl.handle.net/2014/17098
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| Title: | Technical Challenges in Reliable MicroelectroniCs Packaging of Microelectromechanical Systems (MEMS) for Space Applications |
| Authors: | Ramesham, R. |
| Issue Date: | May-1999 |
| Citation: | Electronics Packaging for Space Application Workshop
Pasadena, CA, USA |
| Abstract: | MEMS have shown a significant promise in the last decade for a variety of applications such as air-bag, pressure sensors, accelerometer, microgyro, chemical sensors, artificial nose, etc. |
| URI: | http://hdl.handle.net/2014/17098 |
| Appears in Collections: | JPL TRS 1992+
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