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Please use this identifier to cite or link to this item:
http://hdl.handle.net/2014/16283
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| Title: | Dimpled Ball Grid Array process development for space flight applications |
| Authors: | Barr, S. L.
Mehta, A. |
| Issue Date: | 19-Oct-2000 |
| Citation: | 2001 IEEE Aerospace Conference
Big Sky, Montana, USA |
| Abstract: | The 472 Dimpled Ball Grid Array (D-BGA) package has not been used in past space flight environments, therefore it is necessary to determine the robustness and reliability of the solder joints. The 472 D-BGA packages passed the above environmental tests within the specifications and are now qualified for use on space flight electronics. |
| URI: | http://hdl.handle.net/2014/16283 |
| Appears in Collections: | JPL TRS 1992+
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