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Title: Dimpled Ball Grid Array process development for space flight applications
Authors: Barr, S. L.
Mehta, A.
Issue Date: 19-Oct-2000
Citation: 2001 IEEE Aerospace Conference
Big Sky, Montana, USA
Abstract: The 472 Dimpled Ball Grid Array (D-BGA) package has not been used in past space flight environments, therefore it is necessary to determine the robustness and reliability of the solder joints. The 472 D-BGA packages passed the above environmental tests within the specifications and are now qualified for use on space flight electronics.
Appears in Collections:JPL TRS 1992+

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