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Please use this identifier to cite or link to this item: http://hdl.handle.net/2014/13275

Title: Flip chip packaging of a MEMS neuro-prosthetic system
Authors: Castillo, L. del
Graer, R.
D'Agostino, S.
Mojarradi, M.
Mottiwala, A.
Issue Date: 10-Mar-2002
Citation: International Conference on Advanced Packaging and Systems
Reno, NV, USA
URI: http://hdl.handle.net/2014/13275
Appears in Collections:JPL TRS 1992+

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