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Please use this identifier to cite or link to this item:
http://hdl.handle.net/2014/11592
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| Title: | Flip chip packaging of a MEMS neuro-prosthetic system |
| Authors: | Castillo, L. del
Graber, R.
D'Agostino, S.
Mojarradi, M.
Mottiwala, A. |
| Issue Date: | 10-Mar-2002 |
| Citation: | International Conference on Advanced Packaging Systems
Reno, NV, USA |
| Abstract: | A joint research team from California Institute of Technology and Jet Propulsion Laboratory is developing a fully miniaturized, smart implantable neuro-prosthetic system, by combining integrated electronics with Micro Electro Mechanical Structure (MEMS) based electrode arrays. The packaging group of this project team has been tasked with designing and fabricating a package to interface electrically between a MEMS electrode array, capable of extracting signals from brain, and an electronic chip, capable of providing on chip conditioning/processing of extracted data, while delivering the output data to a detector located outside the body. |
| URI: | http://hdl.handle.net/2014/11592 |
| Appears in Collections: | JPL TRS 1992+
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