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Title: Flip chip packaging of a MEMS neuro-prosthetic system
Authors: Castillo, L. del
Graber, R.
D'Agostino, S.
Mojarradi, M.
Mottiwala, A.
Issue Date: 10-Mar-2002
Citation: International Conference on Advanced Packaging Systems
Reno, NV, USA
Abstract: A joint research team from California Institute of Technology and Jet Propulsion Laboratory is developing a fully miniaturized, smart implantable neuro-prosthetic system, by combining integrated electronics with Micro Electro Mechanical Structure (MEMS) based electrode arrays. The packaging group of this project team has been tasked with designing and fabricating a package to interface electrically between a MEMS electrode array, capable of extracting signals from brain, and an electronic chip, capable of providing on chip conditioning/processing of extracted data, while delivering the output data to a detector located outside the body.
Appears in Collections:JPL TRS 1992+

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