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3-D VLSI architecture data fusion neural networks
3-D VLSI architecture reconfigurable multilayer perceptron synapse neuron pair
3-dimensional artificial neural network (3DANN) Column Loading Input Chip (CLIC) image data parallel processing
3-dimensional ocean general circulation models (OGCMs) meso-scale eddies radius of deformation
3-dimensional stereo images
32 GHz
35 GHz communications gyrotron phase locking spacecraft communications injection locking
3D
3D computer automated grid test
3D CSP stack CSP Chip Scale Package MCM Mulitchip Package
3D data fusion multiresolution surface generation octree
3D deformable non-orthogonal grid code PIC codes paralled computers algorithm electromagnetic field solve distorted meshes
3D electronics
3D heliospheric magnetic field solar maximum Ulysses solar wind streams
3D imaging
3D imaging system
3D packaging
3D Packaging Technologies Flight Computer Avionics New Millenium Program (NMP)
3D printing
3D quantum transport
3D quantum transpot supercell resonant tunneling pre-conditioner
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